“Cutting edge manufacturing solutions"

Solution ranging from rapid prototyping, high/medium/low product manufacturing mix from our various facilities located in Chennai, Bengaluru, INDIA and Atlanta, USA.

We have over 25 years of immersive experience of advanced PCB Assembly technology, resulting in proven processes and a range of services. With more than 10 SMT lines we provide highly complex PCB assemblies with very high yield. Sienna's PCB assembly facilities are future ready, providing support on next generation chip mounting capabilities. Our Zero-defect approach combined with our-state-of-the-art test and inspection system ensures that only high-quality products leave our factories, to be delivered to our various global customers.


  • High complex double-sided PCB assembly
  • High mix, low to medium volume assemblies
  • 10 SMT assembly lines
  • Fine Pitch SMT, through-hole and POP assemblies, backplanes
  • Automated optical inspection
  • In-circuit and flying probe test
  • X-ray inspection
  • Full functional testing, automatic testing equipment and End-of-Line (EOL) testing
  • Conformal coating
  • IPC 610 standards class 2 and class 3
  • Design for manufacturing (DFM), Design for Assembly (DFA) & Design for Test (DFT) analysis
  • End-to-end manufacturing traceability
  • Rapid prototyping
  • Clean Room capability Class 1000/ISO 6